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COB Fine Pitch LED Display
Pixel Pitch :0.78mm/0.93mm/1.25mm/1.56mm
Size :600 x 337.5mm
Weight :6.5kg
Feature Details :Fixed
Independently Design Independently design and manufacture full-flip Mini Chip with a size of only 0.015mm². Independent research and development of Mini LED mass transfer technology and automated mass transfer equipment, UPH≥2.5KK, transfer yield rate as high as 99.99%. Mature COB mass production technology, the entire line is automated without manual contact, and Mini COB Rework technology achieves a yield rate of 100%. | |
Control the entire industry chain and pursue quality standardization From chip design to the management of the entire industry chain of terminal products, the quality of the whole process is controlled, and product quality is more assured. Product problems are 100% traceable, and the source processing is faster, better, and more worry-free, giving customers a peace of mind experience that they have never had before. | |
Surface treatment scheme to create standardization of ink color Fully independent patent coating technology, single pixel black area is as high as 99%, uniform color when black screen, high ink color consistency | |
Optical display advantage, refreshing visual standardization The ultra-high dynamic contrast ratio of up to 2,500,000:1 is less affected by ambient light, and the image quality is clear and delicate; 3840Hz high refresh rate, 22Bit grayscale, presents excellent visual effects. Fully flip-chip RGB three-primary color imaging technology, NTSC color gamut area is greater than 120%, support HDR function, rich color gradation, bright and dark details are clearer. | |
Flip-chip technology, standardized protection level The solder joints of the full flip chip are reduced by 53.8% compared with the formal chip, which is bump-proof and highly reliable. Encapsulation layer and various surface treatment processes, the front of the module reaches IP65 level protection, waterproof, dustproof, anti-static, anti-shock and anti-scratch | |
Smart module design, standardization of assembly and maintenance Standard 16:9 widescreen modular design, supports 2K/4K/8K display; supports hoisting, wall mounting, floor installation, and adaptation to complex site installation. Smart module design, modules can be interchanged/replaced at any position during assembly and maintenance; after replacement, there is no need to re-calibrate the entire screen point by point and reconfigure the display position information to ensure ink color consistency and display effect consistency. Supports front maintenance, rear maintenance*, and maintenance under lighting conditions, greatly reducing maintenance costs and difficulties. |
Main Data Sheet
Mode Number | COB0.78 | COB0.93 | COB1.25 | COB1.56 |
Pixel Configuration | 1R1G1B Flip Chip COB | |||
Pixel Pitch | 0.78mm | 0.93mm | 1.25mm | 1.56mm |
Pixel Density (dot/M2) | 1643655 | 1156203 | 640000 | 410914 |
Module size (mm) | 300 x 337.5mm | |||
Module resolution | 394 x 432 | 320 x 360 | 240 x 270 | 192 x 216 |
Cabinet size (mm) | 600 x 337.5mm | |||
Weight | 6.5 kg | |||
Brightness | 0-600 nits adjustable | |||
Maintenance | Front & Back | |||
Contrast | 2,000,000:1 | |||
Grey Level | 22 bit | |||
Refresh Rate | ≥3840 Hz | |||
Viewing Angle | ≥175° | |||
Input Voltage | DC3.7V | |||
Working Temperature | -10℃ - +40℃, 10%PH -90%RH |